Advanced Packaging High Productivity PVD Equipment EL3400

EL3400 supports packaging (PLP, WLP) wiring to various substrates required for next-generation high-density mounting technology such as interposer and Fan-out.
The sputtering process with high adhesion enables the high-density circuit formation required for next-generation devices.


Advanced packaging process

  • Achieves high adhesion on various substrates
    (Corresponding substrate example: Resin, Ceramic, Glass, Silicon wafer)
  • Single-sided sputtering or double-sided sputtering can be selected according to the process applied.
  • System configuration:Vertical Inline configuration
    Applicable process module for one side will be as follows
    • Annealing module
    • Sputtering module
  • Substrate:□650mm