Sputtering Equipment EL3400
EL3400 is vertical in-line sputtering equipment. It supports packaging (PLP, WLP) wiring to various substrates required for next-generation high-density mounting technology.
Information
- Deposition of interconnect wires on various substrates
- Single-sided sputtering or double-sided sputtering can be selected according to the process applied
- Compatible with various substrates such as resin, ceramic, glass, and silicon wafers
- Substrate size : □650 mm、□300 mm、∅300 mm, etc.
- Configurable modules : etching, heating