Advanced Packaging High Productivity PVD Equipment EL3400
EL3400 supports packaging (PLP, WLP) wiring to various substrates required for next-generation high-density mounting technology such as interposer and Fan-out.
The sputtering process with high adhesion enables the high-density circuit formation required for next-generation devices.
Information
Advanced packaging process
- Achieves high adhesion on various substrates
(Corresponding substrate example: Resin, Ceramic, Glass, Silicon wafer) - Single-sided sputtering or double-sided sputtering can be selected according to the process applied.
- System configuration:Vertical Inline configuration
Applicable process module for one side will be as follows
• Annealing module
• Sputtering module - Substrate:□650mm
□300mm
φ300mm