Wafer Bonding Equipment BC7300/BC7000
BC7300/BC7000 is wafer bonding equipment that uses atomic diffusion bonding (ADB) technology, which utilizes atomic diffusion of a sputtered bonding film on the bonding substrate surface.
ADB technology is possible at room temperature and without load force, regardless of wafer material.
Information
- RF Filter
- Power Devices
- LED
- MEMS
- Robust bonding at room temperature and without load force
- Compatible with various substrate materials
- Clean bonding interface through in-situ processing from bonding film deposition to wafer bonding
- Adjustable bonding interface resistance
- Substrate size : Φ4-inch, Φ6-inch, Φ8-inch, Φ12-inch
- Alignment method : Edge Alignment, Alignment Mark (Φ8inch, Φ12inch)