Atomic Diffusion Bonding Equipment BC7000

Creating the future with room-temperature bonding

BC7000 Atomic Diffusion Bonding equipment is based on Canon ANELVA's long experience with ultra-high vacuum and thin film deposition technologies.
This equipment offers ultra-high vacuum in-situ processes of wafer transfer, film deposition, bonding and bonded wafer collection with automatic operation.
It is capable of handling 4-inch and 6-inch wafers. Mirror polished wafers of any materials can be bonded at room temperature without pressure by optimization of metal and thickness of deposited film at bonding interface.


Bonding at room-temperature
It is not required to heat up due to using atomic diffusion.

No pressure during bonding
It is not required to pressurize due to using surface energy.

High bonding strength
Provides high bonding strength, excellent reliability and high endurance due to metal binding.

Bonding of any similar or dissimilar materials
It is available to adapt the low thermal budget device or differential metals with discrepancy of thermal expansion coefficient.

  1. Metal film deposits on each wafer
  2. They contact each other in-situ of ultla high vacuum
  3. They can be bonded with atomic diffusion

Schematics of Bonding Process

Advanced Packaging

Power device

Optical device


RF device


  • System configuration:Cluster type
  • Substrate:φ100mm, φ150mm
  • Main pump:Turbo Molecular Pump (TMP)
  • Electric power:3φ AC200V±10% 125A 50/60Hz
  • Cooling water:30 - 34L/min 0.2 - 0.3MPa 15 - 30℃
  • Compressed air:0.5 - 0.8MPa
  • Process Gas:0.15 - 0.4MPa
  • Throughput:3.5min/set (It varies according to a process condition)
  • Weight:3720kg (Main body)
  • Footprint:W3300mm×D5100mm (standard specification)