Sputtering Equipment IC7500
IC7500 is sputtering equipment with extensive mass-production experience for DRAM bit lines.
Featuring next-generation sputtering modules optimized for low-resistance requirements, it supports both current and future device generations.
Information
- Metal interconnects
- Barrier TaN(Ta) / seed Cu
- Barrier Ti / seed Cu
- DC sputtering module
High productivity and stability enabled by cathode magnet position control - RF sputtering module (Ionized sputtering module)
Deposition of low-resistivity metal thin films, such as tungsten (W)
Low plasma damage
High step coverage
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- Substrate size : Φ12-inch
- Number of installed modules : up to 5 modules
- Configurable modules : etching, heating