PVD Equipment for Semiconductor (φ300mm support) EC7800

Upgrade from HC7100 (PVD equipment for head) enabling mass-production of φ300 mm wafers based on experience with the φ300 mm wafer production line.
Architectural integration with the proven I-1000 series enables utilization of conventional software assets such as EES.



  • Offers excellent film thickness distribution of ±1% or less with the use of new sputtering technology LRP (Low Pressure Remote Plasma Sputtering).
  • Provides very flat and low resistance film with low pressure discharge at 0.02Pa, which is an order of magnitude lower than conventional sputtering pressure.
  • Provides high MR ratio with ultra-high vacuum.
  • Extensive deposition module lineup. (multi-cathode specification)
  • System configuration:Cluster type
  • Substrate size:φ300mm