Interconnect PVD Equipment IC7200

IC7200 is cluster PVD equipment for thin film deposition, main application of which is Semiconductor Interconnect process.

Fine uniformity and low level particle are achieved even in reactive PVD or high stress process by the original designed cathode (CAERA).

IC7200 is highly reliable φ200mm PVD equipment which has abundant process data.


Interconnect metal process for high volume manufacturing of semiconductor memory

  • CAERA cathode has erosion control function by 3 axis magnet rotation
  • Target utilization is improved by CAERA cathode
  • PCM (Point Cusp Magnet ) cathode is optional IC7200 cathode, which improves step coverage and reduces plasma damage
  • System configuration:Cluster type
  • Substrate size:φ200mm