Sputtering Equipment IC7200
IC7200 is sputtering equipment for thin film deposition, mainly applied to semiconductor interconnect processes. Superior thickness uniformity and low particle levels are achieved even in reactive PVD or high stress process by the original designed cathode.
Information
- Metal interconnects
- Barrier Ti / seed Cu
- DC sputtering module
High productivity and stability enabled by cathode magnet position control - RF sputtering module (Ionized sputtering module)
Low plasma damage
High step coverage
- Substrate size : Φ8-inch
- Number of installed modules : up to 5 modules
- Configurable modules : etching, heating