Sputtering Equipment NC7900
NC7900 is sputtering equipment designed for multi-layer deposition processes, such as Magnetic Tunnel Junction (MTJ).
The system is equipped with a multi-cathode sputtering module to achieve high throughput and minimize particle generation. It is the successor to the EC7800.
Information
- Multi-layer deposition processes (MRAM, Magnetic sensor, etc.)
- Memory devices such as non-volatile memory
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Atomic-level thickness uniformity and precise film thickness control
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Achieving high-quality interface control by integrating processing modules such as etching and heating
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Multi-layer deposition under ultrahigh-vacuum(up to 32 cathodes)
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Excellent long-term stability through real-time monitoring and correction
- Substrate size : Φ8-inch, Φ12-inch
- Number of installed modules : up to 10 modules
- Configurable modules : etching, oxidation, heating, cooling