Sputtering Equipment HC7100
HC7100 is sputtering equipment designed for multi-layer deposition processes, such as MTJ.
It offers mass production capabilities for GMR and TMR heads, and supports thin film deposition processes for memory devices such as MRAM.
Information
- Multi-layer deposition processes (MRAM, Magnetic sensor, etc.)
- Memory devices such as non-volatile memory
- Atomic-level thickness uniformity and precise film thickness control
- Achieving high-quality interface control by integrating processing modules such as etching and heating
- Multi-layer deposition under ultrahigh-vacuum
- Substrate size : Φ6-inch, Φ8-inch
- Number of installed modules : up to 6 modules
- Configurable modules : etching, oxidation, heating, cooling