Sputtering Equipment for Magnetic Heads HC7100

HC7100 is sputtering equipment for GMR heads and TMR heads that utilizes the tunnel effect.


Magnetic head production

  • Offers excellent film thickness distribution of ±1% or less with the use of new sputtering technology LRP (Low Pressure Remote Plasma Sputtering).
  • Provides very flat and low resistance film with low pressure discharge at 0.02Pa, which is an order of magnitude lower than conventional sputtering pressure.
  • Provides high MR ratio with ultra-high vacuum.
  • Extensive deposition module lineup. (multi cathode specification)
  • System configuration:Cluster type
  • Substrate size:φ150mm, φ200mm