Sputtering Equipment for Magnetic Heads HC7100
HC7100 is sputtering equipment for GMR heads and TMR heads that utilizes the tunnel effect.
Information
Magnetic head production
- Offers excellent film thickness distribution of ±1% or less with the use of new sputtering technology LRP (Low Pressure Remote Plasma Sputtering).
- Provides very flat and low resistance film with low pressure discharge at 0.02Pa, which is an order of magnitude lower than conventional sputtering pressure.
- Provides high MR ratio with ultra-high vacuum.
- Extensive deposition module lineup. (multi cathode specification)
- System configuration:Cluster type
- Substrate size:φ150mm, φ200mm