Exhibit at 2024 8th International Workshop on Low Temperature Bonding for 3D Integration

It is our great pleasure to inform you that we will be introducing our products during 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (October 30th - November 1st, 2024) in Nara Kasugano International Forum, Japan.

2024 8th International Workshop on Low Temperature Bonding for 3D Integration

Event overview

Dates

Wednesday, October 30 2024

Thursday, October 31, 2024

Friday, November 1, 2024

Venue

Nara Kasugano International Forum, Japan

Access

http://www.i-ra-ka.jp/en/

Exhibit

Atomic Diffusion Bonding equipment BC7000, BC7300

For any enquiries, please contact us at the address below

Japan :

Canon ANELVA Corporation, Corporate Planning Center

📧 : marketing@mail.canon