PVD Equipment for R&D EB1000

The EB1000 is PVD equipment for R&D with enhanced functions to support simultaneous 3-source sputtering and high temperature heating of substrates while reducing the required space. It is equipped with load lock chamber(option) and provides automated pumping operation as standard to support R&D applications in a variety of fields.



  • Fully automated vacuum pump operation (Touch screen operation)
  • Equipped with three φ2" compact cathodes
  • Simultaneous 3-source sputtering (Option)
  • Support for various substrate size (≤ φ100mm) and deposition methods (offset self-rotational deposition, static facing deposition) by tray transport
  • Space saving achieved by compact design
  • System configuration:Tray transport method (Load lock is option)
  • Substrate size:φ150mm maximum (With load lock; greatest φ100mm)
  • Cathode:φ2" cathode ×3
  • Operation method:Auto pumping operation, manual transport/deposit operation
  • Footprint:W1800mm×D1100mm×H1550mm (standard specification)