Sputtering Equipment EC7430
The EC7430 is a dual-cathode sputtering system equipped with advanced plasma control technology for superior plasma stability.
By combining co-sputtering and reactive processes, it supports next-generation film development while reducing target usage costs in mass production.
Information
- RF Filter
- Piezoelectric films (AlScN, KNN, etc.)
- Stable deposition performance even if the insulating film continues to accumulate on the grounded shield (graph1)
- High deposition rate and superior thickness uniformity
- Controlling film properties through substrate biasing
- Target cost reduction enabled by reactive sputtering and co-sputtering processes
graph1
- Substrate size : Φ4-inch, Φ6-inch, Φ8-inch, Tray-based substrate
- Number of installed modules : up to 3 modules