Exhibit at 2026 9th International Workshop on Low Temperature Bonding for 3D Integration
It is our great pleasure to inform you that we will be introducing our products during 2026 9th International Workshop on Low Temperature Bonding for 3D Integration (May 13th - May 15th, 2026) in Kanazawa Bunka Hall, Ishikawa, Japan.
2026 9th International Workshop on Low Temperature Bonding for 3D Integration
Event overview
- Dates
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Wednesday, May 13 2026
Thursday, May 14, 2026
Friday, May 15, 2026
- Venue
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Kanazawa Bunka Hall, Ishikawa, Japan
- Access
For any enquiries, please contact us at the address below
- Japan :
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Canon ANELVA Corporation, Corporate Planning Center